SPIE Photonics West 2020
4 February 2020 – 6 February 2020
Booth: 160
San Francisco,
California, USA
SPIE LASE Presentation: “Output laser coupler for coherent beam combining” [11261-34]
Session: Components and Packaging for Laser Systems VI, Session 8: High Power/Energy Laser Components III
When: 5 February 2020, 10:30 am-12:00 pm
OFC 2020
10 March 2020 – 12 March 2020
Booth: 4609
San Diego,
California, USA
OFC Presentation: “Low Return Loss Multicore Fiber-Fanout Assembly for SDM and Sensing Applications” [M2C.3]
Session: SDM Imaging & Sensing
When: March 9, 2020: 11:15 am
Where: Room 2
Sponsor and Presenter at the Pic Training Silicon Valley 2019
9 December – 13 December, 2019
Presentations on photonic integration cover all the material systems. The training is supported by a broad consortium of companies, including Chiral Photonics.
World Photonics Technology Summit 2019
29-30 August 2019
Berlin, Germany
Invited Presentation: “Pitch Reducing Optical Fiber Array – Bridging the Gap Between Fiber Infrastructure and Dense Multichannel Optical Interfaces“
See the video presentation here.
Photonics West 2019
Booth: 159
2 Feb 2019 – 7 Feb 2019
San Francisco, California, USA
OFC 2019
Booth: 4806
5-7 March 2019
San Diego, California, USA
Sponsors of the Pic Training Silicon Valley 2019, 28 January – 1 February, 2019
Presentations on photonic integration cover all the material systems, whether Silicon, InP-based, or dielectrics such as TriPleX (SiO2/Si3N4). The training is supported by a broad consortium of companies and is hands-on as well as in-depth.
Sponsors of the PIC Workshop at OFC 2018, Wednesday, Mar 14, 2018, Room 29ABCD
Wednesday, March 14, 2017 from 5:45 to 8:30pm. Presentations on photonic integration including overview of (MPW) foundries, design & layout S/W, packaging, test & measurement, design houses, etc., with special focus on what is new in these areas.
PIC Training Silicon Valley 2017
13 Nov 2017 – 17 Sep 2017, Santa Clara, California, USA
Chiral Photonics is a sponsor and presenter at the PIC Training Silicon Valley 2017 in Santa Clara, CA.
Chiral Photonics presented “Photonic Integrated Circuit Packaging Fundamentals” at the meeting where there were presentations and hands-on training led by industry experts across a broad spectrum of innovating companies.
Photonics Summit and Workshop 2017
06 Sep 2017 – 07 Sep 2017, San Jose, CA, USA
Chiral Photonics presented “Optical Input / Output Considerations for Photonic Integrated Circuit Coupling & Packaging” on September 6, 2017. Hosted by Cadence, Lumerical, and PhoeniX Software the Photonics Summit brings together developers, technology users, and industry experts for a full day of networking and education on the latest photonic tools and methodologies.
White House Announces New Integrated Photonics Manufacturing Innovation Hub with Chiral Photonics as key partner.
Pine Brook, NJ, July 27, 2015.
OptoDesigner 5 Adds Design Support for High Density Optical I/O and PIC Packaging,
Chiral Photonics, Inc. Press Release, Pine Brook, NJ November 17, 2014.
Chiral Photonics introduces PROFA for high density, fiber-to-chip applications. Victor Kopp, Director of R&D, introduces the new technology (Video). OFC/NFOEC 2012 Conference, Los Angeles, CA, March 10, 2012.
“Chiral Photonics, Inc. demonstrates Pitch Reducing Optical Fiber Array (PROFA) enabling highly dense 2D fiber array interfaces“, Chiral Photonics, Inc. Press Release, Pine Brook, NJ February 7, 2012.